Dycure Series (Micro Dicyandiamide)

Dycure Series (Micro Dicyandiamide)
Product Description

Dycure used at thermosetting epoxy resin system as latent curing agent, which is less than 1.6%of dispersant, in order to prevent the product caking and promote Dycure evenly dispersed in theepoxy resin system, widely used in one-component adhesive glue agent, composite materialsand powder coating.Also supply customized supply customized 10um, 8um, 6um, 4um, etc.

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Ningxia Hengkang Technology Co.,Ltd

  • Country/Region:
    China
  • On CPHI since:
    2015
  • Certificates:
    5
  • Employees:
    250 - 499
Company types
Manufacturer/Innovator
View company profile
Specifications
  • Supplied from
    China
More specifications Fewer specifications

Ningxia Hengkang Technology Co.,Ltd

  • Country/Region:
    China
  • On CPHI since:
    2015
  • Certificates:
    5
  • Employees:
    250 - 499
Company types
Manufacturer/Innovator
View company profile

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